Takemoto Tadashi | Joining And Welding Res. Inst. Osaka Univ.

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概要

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著作論文

Application of Nd:YAG Laser to Aluminum Alloy Sorting
Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
Interfacial Reaction between Sn-Ag-Co Solder and Metals
Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test
Microstructure and Tensile Properties of Sn-3.0Ag-0.5Cu Bulk Solders with Minor Additive of Co and Ni
Electrical Characteristics of a New Class of Conductive Adhesive
Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive
Reaction of Iron-based Alloys with Molten Lead-free Solder(Materials, Metallurgy & Weldability)
Solderability of Bulk Metallic Glasses Using Lead-Free Solders
Dealloying of Cu-Zr-Ti Bulk Metallic Glass in Hydrofluoric Acid Solution
Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders
Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
Evaluation of Absorbed Impact Energy of Sn–3.0Ag–0.5Cu (–xCo) Solder Joints with Co–P Plating a Using Ball Impact Test
Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system
Reduction of Damage of Soldering Iron Tip by Addition of Co and Ni to Sn-Ag-Cu Lead-free Solder

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