Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2008-05-01

著者

• Shohji Ikuo

  Graduate School Of Engineering Gunma University

• Osawa Tsutomu

  Graduate School Of Engineering Gunma University

• Takemoto Tadashi

  Joining And Welding Res. Inst. Osaka Univ.

• Yasuda Kiyokazu

  Graduate School Of Engineering Osaka University

• MATSUKI Takashige

  Faculty of Engineering, Gunma University

• KARIYA Yoshiharu

  Faculty of Engineering, Shibaura Institute of Technology

• Kariya Yoshiharu

  Faculty Of Engineering Shibaura Institute Of Technology

• Shohji Ikuo

  Dep. Of Mechanical System Engineering Graduate School Of Engineering Gunma Univ.

• Matsuki Takashige

  Faculty Of Engineering Gunma University

関連論文

• Application of Nd:YAG Laser to Aluminum Alloy Sorting
• Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
• Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
• Interfacial Reaction between Sn-Ag-Co Solder and Metals
• Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test
• Microstructure and Tensile Properties of Sn-3.0Ag-0.5Cu Bulk Solders with Minor Additive of Co and Ni
• Electrical Characteristics of a New Class of Conductive Adhesive
• Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive
• Highly Precise Positioning Method by Pull-Up Model Self-Alignment Process Using Liquid Surface Tension
• Reaction of Iron-based Alloys with Molten Lead-free Solder(Materials, Metallurgy & Weldability)
• Solderability of Bulk Metallic Glasses Using Lead-Free Solders
• Dealloying of Cu-Zr-Ti Bulk Metallic Glass in Hydrofluoric Acid Solution
• Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
• Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders
• Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
• Evaluation of Absorbed Impact Energy of Sn–3.0Ag–0.5Cu (–xCo) Solder Joints with Co–P Plating a Using Ball Impact Test
• Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system
• Reduction of Damage of Soldering Iron Tip by Addition of Co and Ni to Sn-Ag-Cu Lead-free Solder

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