Shohji Ikuo | Faculty Of Engineering Gunma University
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概要
関連著者
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Shohji Ikuo
Faculty Of Engineering Gunma University
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SHOHJI Ikuo
Faculty of Engineering, Gunma University
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Shohji I
Gunma Univ. Kiryu Jpn
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HIOKI Susumu
Faculty of Systems, Science and Technology, Akita Prefectural University
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TAKAHASHI Takehiko
Akita Prefectural University
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HIOKI Susumu
Akita Prefectural University
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MORI Fuminari
IBM Japan
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NAGANO Megumi
Fuji Electric Corporate Research and Development, Ltd.
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Takahashi Takehiko
Faculty of Agriculture, Kobe University
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Goto Hiroki
Faculty Of Engineering Gunma University
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NAKAMURA Kiyotomo
Toppan Printing Co., Ltd.
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OOKUBO Toshikazu
Toppan Printing Co., Ltd.
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Kobayashi Kojiro
Graduate School Of Engineering Osaka University
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Nagano Megumi
Fuji Electric Advanced Technology Co. Ltd.
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Kamiya Osamu
Faculty Of Engineering And Resource Science Akita University
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TSUNODA Satoshi
Faculty of Engineering, Gunma University
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WATANABE Hirohiko
Fuji Electric Advanced Technology Co., Ltd.
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ASAI Tatsuhiko
Fuji Electric Advanced Technology Co., Ltd.
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SUZUKI Yosuke
Faculty of Agriculture & Life Science, Hirosaki University
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Asai Tatsuhiko
Fuji Electric Advanced Technology Co. Ltd.
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Tsunoda Satoshi
Faculty Of Engineering Gunma University
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Watanabe Hirohiko
Fuji Electric Advanced Technology Co. Ltd.
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Takemoto Tadashi
Joining And Welding Res. Inst. Osaka Univ.
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Yasuda Kiyokazu
Graduate School Of Engineering Osaka University
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Ichida Akira
Allied Material Corp.
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ARAI Susumu
Faculty of Engineering, Shinshu University
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KOBAYASHI Eiji
Jintech Inc.
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YOSHIDA Tomohiro
Faculty of Engineering, Gunma University
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Arai Susumu
Faculty Of Engineering Shinshu University
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Mori F
Ibm Japan Yasu Jpn
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Ookubo Toshikazu
Toppan Printing Co. Ltd.
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Nakamura Kiyotomo
Toppan Printing Co. Ltd.
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Kawabata Yoshinori
Faculty Of Engineering Gunma University
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Yoshida Tomohiro
Faculty Of Engineering Gunma University
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NAKAMURA Takao
IBM Japan
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FUJIUCHI Shinichi
IBM Japan
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KIMURA Yoshitaka
Apollo Giken Co., Ltd.
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SHIRATORI Yuji
Faculty of Engineering, Gunma University
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YOSHIDA Hiroshi
Allied Material Corp.
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MIZUKAMI Masahiko
Allied Material Corp.
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Shiratori Yuji
Faculty Of Engineering Gunma University
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Shohji Ikuo
Dep. Of Mechanical System Engineering Graduate School Of Engineering Gunma Univ.
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Kimura Yoshitaka
Apollo Giken Co. Ltd.
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Watanabe Hirohiko
Fuji Electric Advanced Technol. Co. Ltd.
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Suzuki Yosuke
Faculty Of Engineering Shinshu University
著作論文
- Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
- Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
- Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
- Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
- Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
- Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
- Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
- Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
- Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
- Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls