Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders

スポンサーリンク

概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2005-11-20

著者

• Takahashi Takehiko

  Faculty of Agriculture, Kobe University

• SHOHJI Ikuo

  Faculty of Engineering, Gunma University

• Shohji I

  Gunma Univ. Kiryu Jpn

• Shohji Ikuo

  Faculty Of Engineering Gunma University

• Kamiya Osamu

  Faculty Of Engineering And Resource Science Akita University

• HIOKI Susumu

  Faculty of Systems, Science and Technology, Akita Prefectural University

• TAKAHASHI Takehiko

  Akita Prefectural University

• HIOKI Susumu

  Akita Prefectural University

関連論文

• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
• The Shape of Humic Acid in Solution as Observed by Small-Angle X-Ray Scattering
• Preparation of Humic Acid Fractions with a Definite Range of Particle Sizes by Gel Permeation Chromatography (GPC)
• Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
• Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
• Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
• Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
• Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
• Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
• Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
• Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
• Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

もっと見る 閉じる

スポンサーリンク