Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2004-03-20

著者

• Shohji Ikuo

  Faculty Of Engineering Gunma University

• Ichida Akira

  Allied Material Corp.

• SHIRATORI Yuji

  Faculty of Engineering, Gunma University

• YOSHIDA Hiroshi

  Allied Material Corp.

• MIZUKAMI Masahiko

  Allied Material Corp.

• Shiratori Yuji

  Faculty Of Engineering Gunma University

関連論文

• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
• Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
• Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
• Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
• Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
• Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
• Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
• Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
• Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

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