Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

スポンサーリンク

概要

著者

関連論文

Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminum Alloy Using Diode Laser
Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
Microstructure and Tensile Strength of Stainless Steel Wires Micro Spot Melted by YAG Laser
Properties of Solder Joints Using Sn-Ag-Bi-In Solder
Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
In-Situ Formation of Nitride Particle Reinforced Titanium Aluminide by Reactive Plasma Arc Melting Process
Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

もっと見る

スポンサーリンク