Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-08-01
著者
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SAKATANI Shigeaki
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KOBAYASHI Kojiro
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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UENISHI Keisuke
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KOHARA Yasuhiro
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
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NISHIURA Masataka
Corporate Quality Administration Department, Matsushita Electronic Component Co. Ltd
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Uenishi Keisuke
Department Of Manufacture Science Osaka University
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Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi Kojiro
Graduate School Of Engineering Osaka University
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Sakatani Shigeaki
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi K
Graduate School Of Engineering Osaka University
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NAKAYAMA Akihiro
Corporate Quality Administration Group, Matsushita Electronic Components Co., Ltd.
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SAKATANI Sigeaki
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Nakayama Akihiro
Corporate Quality Administration Group Matsushita Electronic Components Co. Ltd.
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Kohara Yasuhiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kohara Yasuhiro
Department Of Crystalline Materials Science Nagoya University
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Sakatani Sigeaki
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Nishiura Masataka
Corporate Quality Administration Group Matsushita Electronic Components Co. Ltd.
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Kobayashi Kojiro
Department Of Manufacture Science Osaka University
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