Sn-Ag Based Solders Bonded to Ni-P/Au Plating : Effects of Interfacial Structure on Joint Stength
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概要
- 論文の詳細を見る
- 2003-11-01
著者
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Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Hirose Akio
Department Of Applied Chemistry School Of Engineering Nagoya University
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Hiramori Tomoyuki
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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ITO Mototaka
Surface Science Labs, Toray Research Center. Inc
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TANII Yoshiharu
Surface Science Labs, Toray Research Center. Inc
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Ito Mototaka
Surface Science Labs Toray Research Center. Inc
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Tanii Yoshiharu
Surface Science Labs Toray Research Center. Inc
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Kobayashi Kojiro
Department Of Manufacture Science Osaka University
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