Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-08-01
著者
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SAKATANI Shigeaki
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KOBAYASHI Kojiro
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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UENISHI Keisuke
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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SAEKI Toshio
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
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KOHARA Yasuhiro
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
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Uenishi Keisuke
Department Of Manufacture Science Osaka University
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Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi Kojiro
Graduate School Of Engineering Osaka University
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Sakatani Shigeaki
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Yamamoto Masaharu
Kagoshima Sumitoku Electronics Co. Ltd.
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Saeki Toshio
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi K
Graduate School Of Engineering Osaka University
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Kohara Yasuhiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kohara Yasuhiro
Department Of Crystalline Materials Science Nagoya University
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Kobayashi Kojiro
Department Of Manufacture Science Osaka University
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