Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2001-05-20
著者
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KOBAYASHI Kojiro
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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UENISHI Keisuke
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Shoji Ikuo
Department Of Virology Ii National Institute Of Infectious Diseases
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Shoji Ikuo
Department Of Mechanical System Engineering Faculty Of Engineering Gunma University
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SAEKI Toshio
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
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KOHARA Yasuhiro
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
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NISHIURA Masataka
Corporate Quality Administration Department, Matsushita Electronic Component Co. Ltd
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YAMAMOTO Masaharu
Electronic Materials Division, Sumitomo Special Metals Co. Ltd.
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Uenishi Keisuke
Department Of Manufacture Science Osaka University
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Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi Kojiro
Graduate School Of Engineering Osaka University
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Yamamoto Masaharu
Kagoshima Sumitoku Electronics Co. Ltd.
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Saeki Toshio
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi K
Graduate School Of Engineering Osaka University
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Kohara Yasuhiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kohara Yasuhiro
Department Of Crystalline Materials Science Nagoya University
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Nishiura Masataka
Corporate Quality Administration Group Matsushita Electronic Components Co. Ltd.
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Kobayashi Kojiro
Department Of Manufacture Science Osaka University
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