Properties of Solder Joints Using Sn-Ag-Bi-In Solder
スポンサーリンク
概要
- 論文の詳細を見る
- 2004-04-20
著者
-
KOBAYASHI Kojiro
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
-
HOJO Takashi
Department of Surgery, Keio University School of Medicine
-
Hojo Tadashi
Graduate School Of Engineering Osaka University
-
Hojo Takashi
Department Of Surgery Keio University School Of Medicine
-
Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
-
Kobayashi Kojiro
Graduate School Of Engineering Osaka University
-
Yamaguchi Akira
Matsushita Electric Industrial Co. Ltd.
-
Hirose A
Graduate School Of Engineering Osaka University
-
Hirose Akio
Department Of Applied Chemistry School Of Engineering Nagoya University
-
Furusawa Akio
Environmental Production Engineering Laboratory Matsushita Electric Industrial Co. Ltd.
-
YAMAGUCHI Atsushi
Corporate Manufacturing Innovation Division, Matsushita Electric Industrial Co., Ltd.
-
YAMASHITA Yuhei
Corporate Manufacturing Innovation Division, Matsushita Electric Industrial Co., Ltd.
-
FURUSAWA Akio
Corporate Manufacturing Innovation Division, Matsushita Electric Industrial Co., Ltd.
-
NISHIDA Kazuto
Corporate Manufacturing Innovation Division, Matsushita Electric Industrial Co., Ltd.
-
SOGO Yosuke
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
-
MIWA Ayako
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
-
SOGO Yousuke
Graduate School of Engineering, Osaka University
-
NISHIDA Kazuto
Matsushita Electric Industrial Co., Ltd.
-
Sogo Yousuke
Graduate School Of Engineering Osaka University
-
Nishida Kazuto
Matsushita Electric Industrial Co. Ltd.
-
Kobayashi K
Graduate School Of Engineering Osaka University
-
Yamaguch Atsushi
Matsushita Electric Industrial Co. Ltd.
-
Miwa Ayako
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
-
Yamashita Yuhei
Corporate Manufacturing Innovation Division Matsushita Electric Industrial Co. Ltd.
-
Kobayashi Kojiro
Department Of Manufacture Science Osaka University
-
Hojo Takashi
Department of Chemistry, Faculty of Technology, Gunma University
-
HOJO Takashi
Department of Breast Oncology, National Cancer Center Hospital
関連論文
- Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
- Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminum Alloy Using Diode Laser
- Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
- BCD-08 DYNAMIC ANALYSIS OF TIMING CHAIN LOAD FOR AUTOMOTIVE ENGINES(BELT AND CHAIN DRIVES)
- Abrasive Wear Resistance of Overlay Composite Alloy with Addition of Carbide Powders
- Lymph Node Metastasis from Breast Cancer Diagnosed by F-18 FDG Whole-body PET (Case report)
- Effect of Nonmetallic Inclusions on Hydrogen Assisted Cracking
- The Effect of Center Segregation of TMCP Steels with Continuous Casting Process on Weld Cold Cracking
- Microstructure and Tensile Strength of Stainless Steel Wires Micro Spot Melted by YAG Laser
- Long-term prognostic study of carcinoembryonic antigen (CEA) and carbohydrate antigen 15-3 (CA 15-3) in breast cancer
- Liquidus Temperature Design of Lead-Free Solder
- Properties of Solder Joints Using Sn-Ag-Bi-In Solder
- Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
- Novel Ultrasonic Soldering Technique for Lead-Free Solders
- Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
- Formation Mechanism of Low Contact Resistance PdZn-based Ohmic Contacts for p-type InP
- Whole-breast volume perfusion images using 256-row multislice computed tomography : visualization of lesions with ductal spread
- Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
- Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
- In-Situ Formation of Nitride Particle Reinforced Titanium Aluminide by Reactive Plasma Arc Melting Process
- Sn-Ag Based Solders Bonded to Ni-P/Au Plating : Effects of Interfacial Structure on Joint Stength
- Chemical Speciation of Large Molecular Metal Complexes in Pond Water
- Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
- Transient Liquid Phase Bonding Process in SiC Fiber Reinforced Ti-6Al-4V Composites
- Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
- Multielement Determination of Rare Eare Earth Elements by Liquid Chromatography/Inductively Coupled Plasma Atomic Emission Spectrometry
- Dual-Times Detection System for On-line Assay of Enzymatic Activity Based on Valve-Switching Technique Using Size Exclusion Chromatography.
- On-line HPLC Determination of Enzymatic Activity of Alkaline Phosphatase in Natural Water Using Spectrofluorometric Detection.
- Dual-times Detaction System for On-line Assay of Enzymatic Activity Based on Valve-switching Technique Using Size Exclusion Chromatography
- On-line HPLC Determination of Enzymatic Activity of Alkaline Phosphatase in Natural Water Using Spectrofluorometric Detection
- Analysis of Myoglobin by Microcolumn Chromatoforcusing with Aid of Size Exclusion Chromatography and Photodiode Array Detection.
- Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
- Rapid Solidification of Ti-25 mol% Al Alloy by Plasma Spraying
- Formation of Hybrid Clad Layers by Laser Processing
- Multielement Determination of Trace Elements in Coastal Seawater by ICP-MS and ICP-AES after Aluminum Coprecipitation Associated with Magnesium
- Simultaneous Multielement Analysis of Rock Samples by Inductively Coupled Plasma Mass Spectrometry Using Discrete Microsampling Technique
- Fabrication of Thick Intermetallic Compound Al_3 Ti Layer on Metal Substrate by Combustion Syntghesis of Ball-milled Powder
- Formation of Thick Ni-Al Composite Coating on Spheroidal Graphite Cast Iron Substrates by Reaction Synthesis Processing
- Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging
- Uranyl ion as a highly effective catalyst for internucleotide bond formation.