Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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KOBAYASHI Kojiro
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Hojo Tadashi
Graduate School Of Engineering Osaka University
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Kobayashi Kojiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kobayashi Kojiro
Graduate School Of Engineering Osaka University
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Yamaguchi Akira
Matsushita Electric Industrial Co. Ltd.
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Hirose A
Graduate School Of Engineering Osaka University
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Furusawa Akio
Environmental Production Engineering Laboratory Matsushita Electric Industrial Co. Ltd.
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SOGO Yousuke
Graduate School of Engineering, Osaka University
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IWANISHI Hiroaki
Graduate School of Engineering, Osaka University
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HIROSE Akio
Graduate School of Engineering, Osaka University
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YAMAGUCH Atsushi
Matsushita Electric Industrial Co., Ltd.
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FURUSAWA Akio
Matsushita Electric Industrial Co., Ltd.
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NISHIDA Kazuto
Matsushita Electric Industrial Co., Ltd.
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Sogo Yousuke
Graduate School Of Engineering Osaka University
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Nishida Kazuto
Matsushita Electric Industrial Co. Ltd.
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Kobayashi K
Graduate School Of Engineering Osaka University
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Yamaguch Atsushi
Matsushita Electric Industrial Co. Ltd.
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Iwanishi Hiroaki
Graduate School Of Engineering Osaka University
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Hojo Takashi
Graduate School of Engineering, Osaka University
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- Liquidus Temperature Design of Lead-Free Solder
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- Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
- Novel Ultrasonic Soldering Technique for Lead-Free Solders
- Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
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