Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-08-01
著者
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SHOHJI Ikuo
Faculty of Engineering, Gunma University
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Shohji I
Gunma Univ. Kiryu Jpn
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Shohji Ikuo
Faculty Of Engineering Gunma University
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HIOKI Susumu
Faculty of Systems, Science and Technology, Akita Prefectural University
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YOSHIDA Tomohiro
Faculty of Engineering, Gunma University
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TAKAHASHI Takehiko
Akita Prefectural University
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HIOKI Susumu
Akita Prefectural University
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Yoshida Tomohiro
Faculty Of Engineering Gunma University
関連論文
- Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
- Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
- Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
- Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
- Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
- Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
- Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
- Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
- Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
- Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
- Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls