Komatsu Akira | Graduate School Of Engineering Osaka University
スポンサーリンク
概要
関連著者
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西川 宏
大阪大学接合科学研究所
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NISHIKAWA Hiroshi
Joining and Welding Research Institute, Osaka University
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TAKEMOTO Tadashi
Joining and Welding Research Institute, Osaka University
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Komatsu Akira
Graduate School Of Engineering Osaka University
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Nishikawa Hiroshi
Joining And Welding Res. Inst. Osaka Univ.
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Takemoto Tadashi
Joining And Welding Res. Inst. Osaka Univ.
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西川 宏
大阪大学 接合科学研究所
著作論文
- Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
- Interfacial Reaction between Sn-Ag-Co Solder and Metals