Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes

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概要

• 論文の詳細を見る
• Japan Society of Applied Physicsの論文
• 2006-12-25

著者

• Zhuang Yun

  Araca Inc.

• PHILIPOSSIAN Ara

  Department of Chemical and Environmental Engineering University of Arizona

• Philipossian A

  Univ. Arizona Az

• Li Zhonglin

  Department Of Chemical And Environmental Engineering University Of Arizona

• LEE Hyosang

  Department of Chemical and Environmental Engineering, University of Arizona

• SEIKE Yoshiyuki

  Asahi Sunac Corporation

• TAKAOKA Mineo

  Asahi Sunac Corporation

• MIYACHI Keiji

  Asahi Sunac Corporation

関連論文

• Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
• Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
• Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
• Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
• Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization
• TRIBOLOGY, FLUID DYNAMICS AND REMOVAL RATE CHARACTERIZATION OF NOVEL SLURRIES FOR ILD POLISH APPLICATIONS
• Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
• Theoretical and Experimental Investigation of Conditioner Design Factors on Tribology and Removal Rate in Copper Chemical Mechanical Planarization
• Dependence of Oxide Pattern Density Variation on Motor Current Endpoint Detection during Shallow Trench Isolation Chemical Mechanical Planarization
• The Spectral Fingerprints and the Sounds of Chemical Mechanical Planarization Processes
• Analysis of Formation of Pad Stains in Copper Chemical Mechanical Planarization
• Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
• Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process
• Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process
• Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization
• Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
• Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

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