TRIBOLOGY, FLUID DYNAMICS AND REMOVAL RATE CHARACTERIZATION OF NOVEL SLURRIES FOR ILD POLISH APPLICATIONS

スポンサーリンク

概要

論文の詳細を見る
2001-09-22

著者

関連論文

Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
TRIBOLOGY, FLUID DYNAMICS AND REMOVAL RATE CHARACTERIZATION OF NOVEL SLURRIES FOR ILD POLISH APPLICATIONS
Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
Dependence of Oxide Pattern Density Variation on Motor Current Endpoint Detection during Shallow Trench Isolation Chemical Mechanical Planarization
The Spectral Fingerprints and the Sounds of Chemical Mechanical Planarization Processes
Analysis of Formation of Pad Stains in Copper Chemical Mechanical Planarization
Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process
The effect of periphyton stoichiometry and light on biological phosphorus immobilization and release in streams
Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process
Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization
Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

もっと見る

スポンサーリンク