Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization

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概要

• 論文の詳細を見る

• Slurry mean residence time (MRT), removal rate, and polishing defects were analyzed for a novel slurry injection system used in chemical mechanical planarization. The novel slurry injection system was placed adjacent to the wafer on the pad surface and slurry was injected towards the wafer through multiple holes in the trailing edge of the injector bottom. Results showed the novel slurry injection system provided more efficient slurry delivery to the pad--wafer interface and generated lower slurry MRT, higher removal rate, and lower polishing defects than the standard pad center area slurry application method currently used in the IC manufacturing industry.

• 2011-05-25

著者

• Zhuang Yun

  Department Of Chemical And Environmental Engineering University Of Arizona

• PHILIPOSSIAN Ara

  Department of Chemical and Environmental Engineering University of Arizona

• Borucki Leonard

  Araca, Inc.

• Meled Anand

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Sampurno Yasa

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Theng Siannie

  Araca, Inc., Tucson, AZ 85718, U.S.A.

• Jiao Yubo

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

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