Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2005-01-15

著者

• Philipossian Ara

  University of Arizona

• Zhuang Yun

  University of Arizona

• Zhuang Yun

  Araca Inc.

• Philipossian A

  Univ. Arizona Az

• Li Zhonglin

  Department Of Chemical And Environmental Engineering University Of Arizona

• Uotani Nobuo

  Showa Denko K. K.

• LI Zhonglin

  University of Arizona, Department of Chemical and Environmental Engineering

• SHIMAZU Yoshitomo

  Showa Denko K. K.

• BORUCKI Leonard

  Intelligent Planar

• Li Zhonglin

  University Of Arizona Department Of Chemical And Environmental Engineering

• Philipossian Ara

  University Of Arizona Department Of Chemical And Environmental Engineering

関連論文

• 高精度CMP終点検出方法の検討(プロセス科学と新プロセス技術)
• Tribological study for low shear force CMP process on damascene interconnects (シリコン材料・デバイス)
• Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
• Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
• Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
• Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
• Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization
• Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
• Theoretical and Experimental Investigation of Conditioner Design Factors on Tribology and Removal Rate in Copper Chemical Mechanical Planarization
• Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes

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