Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
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概要
- 論文の詳細を見る
- 2005-03-15
著者
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Philipossian Ara
The University Of Arizona Department Of Chemical And Environmental Engineering
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Philipossian A
Univ. Arizona Az
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SEIKE Yoshiyuki
Asahi Sunac Corporation
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MIYACHI Keiji
Asahi Sunac Corporation
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DENARDIS Darren
The University of Arizona, Department of Chemical and Environmental Engineering
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SUGIYAMA Masano
The University of Arizona, Department of Chemical and Environmental Engineering
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DOI Toshiro
The University of Arizona, Department of Chemical and Environmental Engineering
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Denardis Darren
The University Of Arizona Department Of Chemical And Environmental Engineering
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Doi Toshiro
The University Of Arizona Department Of Chemical And Environmental Engineering
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Sugiyama Masano
The University Of Arizona Department Of Chemical And Environmental Engineering
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DeNardia Darren
The University of Arizona, Department of Chemical and Environmental Engineering
関連論文
- Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
- Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
- Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
- Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
- Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization
- Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications
- Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes