Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications
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概要
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This study employs real-time high-frequency frictional force analysis coupled with removal rate studies to quantify the extent of frictional forces encountered during copper polish using abrasive-free slurries and to establish the time-dependent tribological attributes of the process. The study also uses spectral analysis of the frictional force data to validate and explore the subtle characteristics of the formation and extinction of the copper complex layer known to play an integral role in abrasive-free copper chemical mechanical planarization (CMP). It was found that copper removal rates are at least partially driven by coefficient of friction, which is similar to the case of interlayer dielectric (ILD) CMP. Spectral analysis suggests that the periodicity of the copper complex layer formation and abrasion is approximately 10 ms.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-11-15
著者
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Philipossian Ara
The University Of Arizona Department Of Chemical And Environmental Engineering
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Sorooshian Jamshid
The University Of Arizona Department Of Chemical And Environmental Engineering
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Denardis Darren
The University Of Arizona Department Of Chemical And Environmental Engineering
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Philipossian Ara
The University of Arizona, Department of Chemical and Environmental Engineering, P.O. Box 210011, Tucson, AZ 85721, USA
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Habiro Masanobu
Hitachi Chemical Co., Ltd., Hitachi, Ibaraki 317-8555, Japan
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Rogers Chris
Tufts University, Department of Mechanical Engineering, 204 Anderson Hall, 200 College Ave., Medford, MA 02155, USA
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DeNardis Darren
The University of Arizona, Department of Chemical and Environmental Engineering, P.O. Box 210011, Tucson, AZ 85721, USA
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Sorooshian Jamshid
The University of Arizona, Department of Chemical and Environmental Engineering, P.O. Box 210011, Tucson, AZ 85721, USA
関連論文
- Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
- Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications