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Division of Materials Science and Engineering, Hanyang University | 論文
- Ni_Fe_/Co/N(N=Ta, Cu, Al)/Al-oxide/Co接合における磁気抵抗効果
- 二重強磁性トンネル接合におけるスピン依存伝導特性
- Co/Al/Al-Oxide/Co接合界面のマグノン非弾性励起
- 強磁性トンネル接合の低抵抗化と熱処理効果
- Comparison of TiN Films Deposited Using Tetrakisdimethylaminotitanium and Tetrakisdiethylaminotitanium by the Atomic Layer Deposition Method
- Compositional Variations of TiAlN Films Deposited by Metalorganic Atomic Layer Deposition Method
- Removal of the Polymer Formed at Via Hole with Via Etching Stopped on an Al layer Structure
- ZrO_2 Gate Dielectric Deposited by Plasma-Enhanced Atomic Layer Deposition Method
- TiN Diffusion Barrier Grown by Atomic Layer Deposition Method for Cu Metallizaiton
- A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
- Metal Oxide Semiconductor Field Effect Transistor Characteristics with Iridium Gate Electrode on Atomic Layer Deposited ZrO_2 High-k Dielectrics
- Improvement of the Reliability of a Cu/W-N/SiOF Multilevel Interconnect by Inserting Plasma Enhanced Chemical Vapor Deposited W-N Thin Film
- Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
- Enhancement of Extreme Ultraviolet Reflective Multilayer Properties by the Insertion of Ru Barrier Layer
- A study of the incorporation of conducting materials into direct-patternable SnO2 thin films formed by photochemical metal-organic deposition
- Fabrication of Polycrystalline Silicon Thin Film Transistors in Array Patterns by Field-Aided Lateral Crystallization Technique
- Dielectric Constant Stability and Thermal Stability of Cu/Ta/SiOF/Si Multilayer Films
- Effects of NH_3 Plasma Treatment on Methyl Silsequioxane for Copper Multi-Level Interconnect(Semiconductors)
- 中間層にAIを用いた二重トンネル接合の磁気抵抗効果
- Field-Emission Activation on Boron-Doped Chemical-Vapor-Deposited Polycrystalline Diamond Films