Fukasawa Masanaga | Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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概要
- Fukasawa Masanagaの詳細を見る
- 同名の論文著者
- Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japanの論文著者
関連著者
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Fukasawa Masanaga
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Fukasawa Masanaga
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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TATSUMI Tetsuya
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation
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Tatsumi Tetsuya
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Nagahata Kazunori
Semiconductor Technology Development Division, SBG, CPDG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Hamaguchi Satoshi
Center For Atomic And Molecular Technologies Graduate School Of Engineering Osaka University
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Kawashima Atsushi
Semiconductor Technology Development Division, SBG, CPDG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Uesawa Fumikatsu
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Kuboi Nobuyuki
Semiconductor Technology Development Division, SBG, CPDG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Oshima Keiji
Semiconductor Technology Development Division, SBG, CPDG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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KUBOI Nobuyuki
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation
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Kondo Hiroki
Deparment Of Physics Saga University
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Hori Masaru
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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TOMIYA Shigetaka
Sony Corporation Research Center
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Sekine Makoto
Department Of Electrical Engineering And Computer Science Nagoya University
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Sekine Makoto
Plasma Technology Laboratory Association Of Super-advanced Electronics Technologies(aset)
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Hori Masaru
Plasma Nanotechnology Research Center Nagoya University
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Ishikawa Kenji
Plasma Technology Laboratory Association Of Super-advanced Electronics Technologies(aset)
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Karahashi Kazuhiro
Center for Atomic and Molecular Technologies, Osaka University, Suita, Osaka 565-0871, Japan
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Kawashima Atsushi
Semiconductor Technology Development Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tanaka Yasuhito
Quality Reliability Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Minami Masaki
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Takeda Keigo
Department of Electric Engineering and Computer Science, Nagoya University, Nagoya 464-8603, Japan
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Matsumoto Ryosuke
Sony Shiroishi Semiconductor Inc., Shiroishi, Miyagi 980-8579, Japan
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Chen Shang
Plasma Nanotechnology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Fukasawa Masanaga
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Uesawa Fumikatsu
Semiconductor Technology Development Division, Core Device Development Group, R&D Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Fukasawa Masanaga
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Fukasawa Masanaga
Semiconductor Technology Development Division, SBG, PDSG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Ohchi Tomokazu
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Kobayashi Shoji
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Kugimiya Katsuhisa
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Kinoshita Takashi
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Takizawa Toshifumi
Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, Suita, Osaka 565-0871, Japan
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Kamide Yukihiro
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Ito Tomoko
Center for Atomic and Molecular Technologies, Osaka University, Suita, Osaka 565-0871, Japan
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Sekine Makoto
Plasma Nanotechnology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Sekine Makoto
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Miyawaki Yudai
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Ishikawa Kenji
Department of Earth and Space Science, Graduate School of Science, Osaka University, 1-1 Machikaneyama, Toyonaka, Osaka 560-0043, Japan
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Ishikawa Kenji
Plasma Nanotechnology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Takagi Hitoshi
Semiconductor Technology Development Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, Semiconductor Business Group, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, SBG, PDSG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Tatsumi Tetsuya
Semiconductor Technology Development Division, SBG, CPDG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Hamaguchi Satoshi
Center for Atomic and Molecular Technologies, Osaka University, Suita, Osaka 565-0871, Japan
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Oshima Keiji
Semiconductor Technology Development Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Kuboi Nobuyuki
Semiconductor Technology Development Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Sakayori Hiroyuki
Quality Reliability Division, SBG, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Hori Masaru
Plasma Nanotechnology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Ishikawa Kenji
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Kondo Yusuke
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Ishikawa Kenji
Plasma Nano-technology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Matsugai Hiroyasu
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Honda Takahiro
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
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Hori Masaru
Plasma Nano-technology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Sekine Makoto
Plasma Nano-technology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Kondo Yusuke
Department Cardiovascular Science and Medicine, Chiba University Graduate School of Medicine
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Uesawa Fumikatsu
Semiconductor Technology Development Division, Advanced Device Technology Platform, Sony Corporation, Atsugi, Kanagawa 243-0014, Japan
著作論文
- Prediction of Fluctuations in Plasma–Wall Interactions Using an Equipment Engineering System
- Si Recess of Polycrystalline Silicon Gate Etching: Damage Enhanced by Ion Assisted Oxygen Diffusion
- Analysis of GaN Damage Induced by Cl2/SiCl4/Ar Plasma
- Analysis of Plasma Wall Reactions Using Virtual Optical Emission Spectrometry Signal during Dielectric Etching
- Reducing Damage to Si Substrates during Gate Etching Processes
- Wavelength Dependence of Photon-Induced Interface Defects in Hydrogenated Silicon Nitride/Si Structure during Plasma Etching Processes