Nagata H | Osaka Prefecture Univ. Osaka Jpn

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著作論文

Shrinkage Effect of Local Area of Polymer Film on Adhesion Behavior
Blister Formation at Photoresist-Substrate Interface
Local Peeling of Photoresist Film during Ultraviolet Light Exposure
Adhesion of Photoresist Pattern Baked at 80 to 325℃ to Inorganic Solid Surface
Adhesion of Photoresist Pattern Baked at 80 to 325℃ in Tetramethyl-ammonium-hydroxide Aqueous Solution
Characterization of Surface Energetic Behavior by Atomic Force Microscopy
Adhesion of Photoresist Micropattern to Aluminum Substrate in Alkaline Aqueous Solution
Dependence of Offset Error on Overlay Mark Structures in Overlay Measurement
Adhesion between Photoresist and Inorganic Substrate : Resist Material and Process
Adhesion between Photoresist and Inorganic Substrate
Proposal of a Next-Generation Super Resolution Technique
Photolithography System Using Modified Illumination
Photolithography System Using a Combination of Modified Illumination and Phase Shift Mask
Photolithography System Using Annular Illumination : Photolithography
Photolithography System Using Annular Illumination
Preparation of Y-Cu-O/Ba-Co-O Multilayered Thin Films and Thermal Diffusion Behavior of the Interface
Heteroepitaxial Growth of CeO_2 (001) Films on Si(001) Substrates by Pulsed Laser Depostion in Ultrahigh Vacuum
In Situ RHEED Observation of CeO_2 Film Growth on Si by Laser Ablation Deposition in Ultrahigh-Vacuum
Effect of Anion in Developer on Dissolution Characteristics of Photoresist : Resist Material and Process
Effect of Anion in Developer on Dissolution Characteristics of Photoresist
Preparation of Compositionally Modulated Bi-Sr-Ca-Cu-O Multilayered Films by Plasma Controlled Sputtering : Electrical Properties of Condensed Matter
Yield Prediction Method Considering the Effect of Particles on Sub-Micron Patterning (Special Issue on Scientific ULSI Manufacturing Technology)

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