Yield Prediction Method Considering the Effect of Particles on Sub-Micron Patterning (Special Issue on Scientific ULSI Manufacturing Technology)
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概要
- 論文の詳細を見る
A new yield prediction model has been developed, which can successfully describe the actual chip fabrication yield. It basically consists of modeling of particles deposited on wafer surface, considering the change in their size and spatial distribution due to the subsequent processing steps and a new concept of virtual line width in pattern layouts. It is confirmed that this yield prediction model serves as an effective navigator for improvement/optimization of fabrication lines such as pointing out the process step/equipments to be modified for yield improvements.
- 社団法人電子情報通信学会の論文
- 1996-03-25
著者
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Nagata Hitoshi
Ulsi Laboratory Mitsubishi Electric Corporation
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Hattori Nobuyoshi
Ulsi Laboratory Mitsubishi Electric Corporation
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Ikeno Masahiko
ULSI Development Center, Mitsubishi Electric Corporation
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Ikeno Masahiko
Ulsi Development Center Mitsubishi Electric Corporation
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Nagata H
Osaka Prefecture Univ. Osaka Jpn
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- Yield Prediction Method Considering the Effect of Particles on Sub-Micron Patterning (Special Issue on Scientific ULSI Manufacturing Technology)