ARITA Yoshinobu | NTT LSI Laboratories
スポンサーリンク
概要
関連著者
-
ARITA Yoshinobu
NTT LSI Laboratories
-
SATO Masaaki
NTT LSI Laboratories
-
Awaya Nobuyoshi
Ntt Lsi Laboratories
-
Arita Y
Ntt System Electronics Lab. Kanagawa Jpn
-
Sato K
Depertment Of Electrical And Electronic Engineering Tokyo Institute Of Technology
-
Saito K
Department Of Materials Technology Chiba University
-
Sato K
Department Of Electronics And Information Science Teikyo University Of Science And Technology
-
SAITO Kunio
NTT LSI Laboratories
-
AMAZAWA Takao
NTT LSI Laboratories
-
Saito K
Nagaoka National Coll. Technol. Nagaoka Jpn
-
Saito K
Application Laboratory
-
Saito K
Av-it Development Group. Sony Corporation
-
Maeda M
Japan Sci. And Technol. Corp.(jst) Saitama Jpn
-
Ikeda K
Mitsubishi Electric Corp. Hyogo Jpn
-
加藤 愼一
Nttマルチメディアネットワーク研究所
-
Ikeda Keisuke
Institute For Materials Research Tohoku University
-
有田 睦信
NTT LSI 研究所
-
Ikeda Keiji
Department Of Physical Electronics Tokyo Institute Of Technology
-
IKEDA Koichi
NTT LSI Laboratories
-
MAEDA Masahiko
NTT LSI Laboratories
-
Yoshikawa Akira
Ntt Electrical Communications Laboratories
-
天沢 敬生
Ntt Lsi研究所
-
Kato Shin'ichi
Ntt Lsi Laboratories
-
SATO Masaaki
NTT Electrical Communications Laboratories
-
NAKAMURA Hiroaki
NTT Electrical Communications Laboratories
-
ARITA Yoshinobu
NTT Electrical Communications Laboratories
-
AWAYA Nobuyoshi
Process Development Center, Integrated Circuits Group, SHARP Corporation
-
Awaya N
Sharp Corp. Hiroshima Jpn
-
Awaya Nobuyoshi
Process Development Center Integrated Circuits Group Sharp Corporation
-
Ohno Kazuhide
Ntt Lsi Laboratories
-
斎藤 国夫
NTT LSI Laboratories
著作論文
- TiN Thin Film Prepared by Chermical Vapor Deposition Method Using Cp_2Ti(N_3)_2
- プラズマ化学気相成長による選択チタンシリサイド膜堆積とシリサイド張り付けシリコン電極形成プロセス〔英文〕
- Radical Generation Mechanism and Radical Effect on Aluminum Anisotropic Etching in SiCl_4 Reactive Ion Etching
- Effect of Silicon Surface Cleaning on the Initial Stage of Selective Titanium Silicide Chemical Vapor Deposition
- Accelerated-Deposition Rate and High-Quality Film Copper Chemical Vapor Deposition Using a Water Vapor Addition to a Hydrogen and Cu(HFA)_2 Reaction System
- Selective Deposition of Silicon Oxide Using a Plasma-Fluorinated Resist Mask : Surfaces, Interfaces and Films
- Plasma-Enhanced Chemical Vapor Deposition of Copper
- Al-Cu Alloy Etching Using In-Reactor Aluminum Chloride Formation in Static Magnetron Triode Reactive Ion Etching
- Effect of Gas Species on the Depth Reduction in Silicon Deep-Submicron Trench Reactive Ion Etching
- Reactive Ion Etching of Copper Films in SiCl_4 and N_2 Mixture
- Novel Static Magnetron Triode Reactive Ion Etching