LIU Chun-Hsing | Department of Electronic and Computering Engineering, Nan Jeon Institute of Technology

Advanced Module Technology Division Taiwan Semiconductor Manufacturing Company

South Epitaxy Corporation

Institute of Microelectronics & Department of Electrical Engineering National Cheng Kung University

South Epitaxy Corporation

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

South Epitaxy Corporation

Materials R&d Center Chung Shan Inst. Sci. & Technol. Taoyuan Twn

Department of Electronic Engineering, Chin-Min College

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Department Of Electronic Engineering Chin-min College

Chung‐shan Inst. Sci. And Technol. Tao‐yuan Twn

Department Of Electronics Engineering Southern Taiwan University Of Technology

Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers

Department of Electronic Engineering, Cheng Shiu University

Department of Electronic and Computering Engineering, Nan Jeon Institute of Technology

Department of Electronic Engineering, National Yunlin University of Science and Technology

Department of Electronic Engineering, National Yunlin University of Science and Technology

Institute of Microelectronics and Department of Electrical Engineering, National Cheng Kung Universi

Chung-Shan Institute of Science & Technology

Chung Shan Institute of Science and Technology

Institute Of Microelectronics And Department Of Electrical Engineering National Cheng Kung Universit

Advanced Module Technology Division Taiwan Semiconductor Manufacturing Company

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

2Institute of Electronics and Information Engineering, National Yunlin University of Science and Tec

Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers

National Cheng Kung Univ. Tainan Twn

Institute Of Electrical Engineering Da-yeh University

Department Of Electronic Engineering National Yunlin University Of Science And Technology

Department of Electro-Optics Engineering, National Formosa University

Department Of Electro-optical Engineering National Huwei Institute Of Technology

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

Chung Shan Institute of Science and Technology

Department Of Electronic And Computering Engineering Nan Jeon Institute Of Technology

Department Of Electronic Engineering National Yunlin University Of Science And Technology

Chung‐shan Inst. Sci. And Technol. Tao‐yuan Twn

Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers

Department Of Electronic Engineering Nan-jeon Institute Of Technology

Department Of Electronic Engineering Cheng Shiu University

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Department of Electronic and Computering Engineering, Nan Jeon Institute of Technology, Yan-Hsui, Taiwan 737, R.O.C.

Department of Electronic Engineering, Chin-Min College, To-Fen 351, Taiwan

Institute of Electronics and Information Engineering, National Yunlin University of Science and Technology, Touliu, Yunlin 640, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Department of Electronic Engineering, National Yunlin University of Science and Technology, Touliu 640, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan, R.O.C.

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan, R.O.C.

Department of Electronic Engineering, National Yunlin University of Science and Technology, R.O.C.

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan, R.O.C.

Department of Electronic Engineering, Nan-Jeon Junior College of Technology and Commerce, Yan-Hsui 737, Taiwan

Department of Electronic and Computering Engineering, Nan Jeon Institute of Technology, Yan-Hsui, Taiwan 737, R.O.C.

South Epitaxy Corporation, Hsin-Shi 744, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan