Integrated Over-Temperature Protection Circuit for GaN Smart Power ICs
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概要
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As a thermal sensing and protection module on a GaN smart power IC platform, the first GaN over-temperature protection (OTP) circuit is demonstrated to deliver a desirable triggering signal at the critical temperature. The integrated OTP circuit is realized based on monolithic integration of enhancement-/depletion-mode high electron mobility transistors (HEMT) and HEMT-compatible lateral field effect rectifiers on a baseline AlGaN/GaN-on-Si wafer. The circuit effectively indicates the over-temperature up to 250 °C, and has a power supply rejection radio well above 35 dB. This sensing/protection circuit is expected to provide enhanced reliability to the high-voltage GaN power devices.
- 2013-08-25
著者
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Chen Kevin
Department Of Electrical And Electronic Engineering Hong Kong University Of Science And Technology
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Kwan Alex
Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
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Liu Xiaosen
Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
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Guan Yue
Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
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