Two Different Multisensors Fabricated by Various Manufacturing Methods

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概要

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• In this paper, we propose two different types of multisensor fabricated by various manufacturing methods. The first type of multisensor is fabricated all on the same chip. This type of the multi-sensor consists of three different sensors, a piezoresistive sensor, a capacitive proximity sensor, and a photodiode sensor for system units consisting of two different sensors, a capacitive proximity sensor and a photodiode sensor for mobile applications. The second type of multisensory, which is responsible for each function, is combined with a sandwich structure. This type of the multisensor consists of three different sensors: a piezoresistive sensor, a tilt sensor, and a photodiode sensor. The various components of the multisensor can perceive different types of external tamper independently, resulting in more reliable responses. The multisensor could be applied to detect external tampering on various types of system unit.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2009-04-25

著者

• EUN Duk-Soo

  Department of Electronics, Kyungpook National University

• Shin Jang-kyoo

  Department Of Electrical And Electronic Engineering Toyohashi University Of Technology:school Of Ele

• Lee Jong-hyun

  Department Of Electronics Kyungpook National University

• Shin Jang-Kyoo

  Department of Electronics, Graduate School, Kyungpook National University, 1370 Sankyuk-dong, Buk-gu, Daegu 702-701, Republic of Korea

• Lee Jong-Hyun

  Department of Electronics, Graduate School, Kyungpook National University, 1370 Sankyuk-dong, Buk-gu, Daegu 702-701, Republic of Korea

• Eun Duk-Soo

  Department of Electronics, Graduate School, Kyungpook National University, 1370 Sankyuk-dong, Buk-gu, Daegu 702-701, Republic of Korea

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