Evaluation of Interface Adhesion Strength in Cu/(Ta–$x$% N, Ta/TaN)/SiO2/Si by Nanoscratch Test
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概要
- 論文の詳細を見る
The adhesion strength of Cu/(Ta–$x$% N, Ta/TaN)/SiO2/Si was investigated and the feasibility of the nanoscratch technique was evaluated. Because of the grain orientation dependence of critical load owing to elastic/plastic anisotropy, the interface adhesion measured in the mix-textured films of $\langle 111\rangle$ and $\langle 100\rangle$ showed a wide-range data spread to higher adhesion strength compared with the highly $\langle 111\rangle$ textured films. The adhesive energy derived from the measured critical load by considering the residual stress and the effect of grain orientation by the aid of finite element method calculation showed a reasonable agreement with theoretical work of adhesion. It was revealed that the adhesion strength of Cu/Ta–$x$% N decreases with increasing nitrogen concentration. This tendency can be associated with increasing number of weak Cu–N bonding along the Cu/barrier interface.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-02-25
著者
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Koike Junichi
Department Of Materials Science Graduate School Of Engineering Tohokuuniversity
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Sekiguchi Atsuko
Department Of Clinical Research Oriental Medicine Research Center Kitasato University
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