Finite Element Method Analysis of Nanoscratch Test for the Evaluation of Interface Adhesion Strength in Cu Thin Films on Si Substrate
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概要
- 論文の詳細を見る
Mechanical processes of the nanoscratch test are investigated using a finite element analysis of Cu/Ta/SiO2/Si multilayer films. The calculated stress distribution at the moment of delamination suggests that delamination occurs in a small region of approximately 100 nm. The driving force for delamination is the stress concentration due to strain-incompatibility at the Cu/Ta interface resulting from the large plastic deformation in Cu. The degree of stress concentration is found to depend on internal variables, such as plastic deformation, residual stress, and the elastic modulus, and on the magnitude of lateral force.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-01-25
著者
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Koike Junichi
Department Of Materials Science Graduate School Of Engineering Tohokuuniversity
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Sekiguchi Atsuko
Department Of Clinical Research Oriental Medicine Research Center Kitasato University
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Koike Junichi
Department of Materials Science, Tohoku University, Sendai 980-8579, Japan
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