Characterization of Metal Insulator Metal Electrical Properties of Electron Cyclotron Resonance Plasma Deposited Ta2O5
スポンサーリンク
概要
- 論文の詳細を見る
The electrical properties of tantalum pentaoxide (Ta2O5) films deposited by an electron cyclotron resonance (ECR) plasma sputtering have been investigated using metal–insulator–metal (MIM) capacitor structures. The deposition conditions of Ta2O5 films and the bottom electrode materials of the MIM have been examined from the point of view of both the low leakage current and the high capacitance. On the TiN bottom electrode, additional postdeposition plasma irradiation on the first thin Ta2O5 layer was effective in ensuring a high breakdown strength of the MIM, because of the stabilization of the interlayer between the Ta2O5 film and the TiN bottom electrode film. However, the MIM using a Ru bottom electrode, which shows the characteristics of conductive films even for oxides, showed the high breakdown characteristics of approximately 4.5 MV/cm for as-deposited Ta2O5 in metal-mode deposition in ECR sputtering. In both cases, the dielectric constant of Ta2O5 was approximately 25, so that a high capacitance of approximately 3 fF/μm2 was for frequencies of up to 1 MHz for a MIM with a Ru bottom electrode and 20-nm-thick Ta2O5 film.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-09-30
著者
-
JIN Yoshito
NTT Microsystem Integration Laboratories
-
Fukuda Yukio
Tokyo University Of Science
-
Kato Koji
Hirosaki University, 3 Bunkyo-cho, Hirosaki, Aomori 036-8561, Japan
-
Ono Toshiro
Hirosaki University, 3 Bunkyo-cho, Hirosaki, Aomori 036-8561, Japan
-
Toyota Hiroshi
Hirosaki University, 3 Bunkyo-cho, Hirosaki, Aomori 036-8561, Japan
関連論文
- Reversible Resistive Switching in Bi_4Ti_3O_ Thin Films Deposited by Electron Cyclotron Resonance Sputtering
- Metal-Oxide-Semiconductor-Diode Characteristics with SiO_2 Films Formed by Oxidation and Sputtering Using Electron-Cyclotron-Resonance-Plasma Stream
- Electrical Behavior of Germanium Oxide/Germanium Interface Prepared by Electron-Cyclotron-Resonance Plasma Oxidation in Capacitance and Conductance Measurements
- Electrical Properties of Germanium Oxynitride and Its Interface with Germanium Prepared by Electron-Cyclotron-Resonance Plasma Oxidation and Nitridation
- Thermal Improvement and Stability of SiN/GeNx/p- and n-Ge Structures Prepared by Electron-Cyclotron-Resonance Plasma Nitridation and Sputtering at Room Temperature
- Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
- Low-Temperature Silicon Oxidation with Very Small Activation Energy and High-Quality Interface by Electron Cyclotron Resonance Plasma Stream Irradiation
- Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
- Electrical Characterization Techniques of Dielectric Thin Films Using Metal–Insulator–Metal Structures
- Characterization of Metal Insulator Metal Electrical Properties of Electron Cyclotron Resonance Plasma Deposited Ta2O5
- Reversible Resistive Switching in Bi4Ti3O12 Thin Films Deposited by Electron Cyclotron Resonance Sputtering