Study on Nano Complementary Metal Oxide Semiconductor Gate Leakage Current
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概要
- 論文の詳細を見る
This work examines different components of the leakage current in scaled N and P-metal oxide semiconductor field-effect transistor (MOSFET) with ultra thin gate oxide. Experimental results show that the gate tunneling leakage current through the source/drain extension region (also named edge direct tunneling, EDT) is the largest component, which dominates the maximum off-state power consumption of a nano-scaled transistor. To clarify the relationship between this largest leakage component and the size of the source/drain to gate overlap region, the proposed capacitance–ratio method (C–R method) was used to precisely extract the dimensions of the source/drain to gate overlap, $L_{\text{ov}}$. To reduce the gate-tunneling leakage at the source/drain edge, a modified gate dielectric structure is proposed and verified in this work.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-05-15
著者
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Wu Yen-ching
Institute Of Automation Technology National Taipei University Of Technology
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Hong Gary
Central Integration United Microelectronics Corporation
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Huang Chia-hung
Institute Of Mechatronics National Taipei University Of Technology
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Huang Heng-sheng
Institute Of Automation Technology National Taipei University Of Technology
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Chen Jeng-Kang
Central Research/Development, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Huang Chia-Hung
Institute of Mechatronics, National Taipei University of Technology, Taipei, Taiwan, R.O.C.
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Hsu Yao-Kai
Central Integration, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Hong Gary
Central Integration, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Huang Heng-Sheng
Institute of Mechatronics, National Taipei University of Technology, Taipei, Taiwan, R.O.C.
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