無電解NiReP合金薄膜抵抗体へのパルス加熱法の適用

概要

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The thermal stability of the electrical resistance properties of electroless NiReP alloy films with three levels of Re content was evaluated, using a pulse heating method that provided a very high heating rate (up to 105Kmin-1) and very short heating time (200ms). The temperature coefficient of resistance (TCR) of the three films had a range of only -100∼250ppmK-1, and the amorphous structure in the as-deposited condition was maintained for all three films even by pulse heating, although, the specific resistance changed slightly. After annealing at 500°C, the specific resistance (340μΩcm) and TCR (18ppmK-1) of the film with the greatest Re content (Ni51Re44P5) was not changed by pulse heating. It was found that the electroless NiReP alloy films were much more stable under pulse heating, than were the electroless NiWP and NiMoP alloy films with good thermal stability.