345 ドライプロセスによる半導体パッケージ用ワイヤボンディング機能性膜形成(加工による機能創製)

概要

論文の詳細を見る
An attempt has been made to form a wire-bonding pad by laser sintering of Ag nanoparticles. The paste containing 55mass% Ag (5 nm in average diameter) was coated on a Cu lead-frame by ink-jet printing, being metalized with an LD laser (980 nm in wavelength). When a φ25 μm Au wire was bonded on the pad (0.2μm in thickness), a pull strength of 8.2 cN was obtained, which is similar to that of an electro-plated Ag film. The laser sintering requires more densification with less pores as well as the formation of a thicker film of 1-2 μm.
一般社団法人日本機械学会の論文
2009-11-06