21410 ドライプロセスによる電子モジュール実装(デバイス&配線技術2,OS.1 機械工学が支援する微細加工技術(半導体・MEMS・NEMS),学術講演)

概要

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In order to establish technology of packaging electronic modules we investigated conditions for laser sintering of Ag nanoparticles and evaluated characteristics of the sintered film. First, we plotted minute patterns on a copper substrate by ink jet printing, and then employed Nd:YAG laser to metalize the ink in a short time. The Ag nanoparticles (5 nm in average diameter) dispersed in organic solvents were solidified to form coarse agglomerate of about 0.05-0.5 μm with a pulsed laser or about 0.05 μm with a CW laser. Finally, we carried out a bend-peel test to find that no separation occurred at the interface. An SEM observation of FIBed cross-sections revealed that the film sintered by laser irradiation is as thin as less than 0.5 pm, and has a porous structure. It was confirmed that an Au wire was able to be bonded on the sintered Ag film at practical level.
一般社団法人日本機械学会の論文
2008-03-13