2716 金属ナノ粒子のインクジェット印刷とレーザ焼結による微細配線法(S33-2 材料の超精密加工とマイクロ/ナノ加工の動向(2),S33 材料の超精密加工とマイクロ/ナノ加工の動向)

概要

論文の詳細を見る
We have examined laser sintering conditions for minute wiring using Ag NanoPaste^[○!R], and evaluated sintering characteristics. First, line patterns were drawn on a Cu substrate by ink-jet printing with the paste: about 80μm in width and about 2μm in thickness. Then, the specimen was dried at 443K for 20min to anchor the paste. Laser sintering of the dried pattern was carried out twice in a row by scanning a beam at average laser powers of 1.99W and 4.45W in air, where a pulsed Nd: YAG laser of 1.06μm wavelength and 0.1mm spot diameter was used. As a result, the Ag nano particles (5nm in average diameter) dispersed in the paste are welded to form coarse agglomerate of about 0.4μm. Adhesion strength between the sintered wire and the substrate was evaluated by a bend-peel test. No separation occurs, which means that strong wiring is achieved by the proposed method.
社団法人日本機械学会の論文
2006-09-15