F143 複合平板の有効熱伝導率簡易推算式に関する理論的検討(電子機器冷却をリードする我が国の先進技術と展望IV)

概要

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A wiring substrate in electronic equipments is a composite board, which consists of several elements having different thermal conductivities, such as wires, vias and matrixes. This paper describes the theoretical investigation on the simple equations to estimate the effective thermal conductivity of such a composite system. Two types of simple estimation equations are derived based on thermal resistance network models. Three-dimensional simulation is also performed to obtain the effective thermal conductivity of the composite system. By changing the geometrical layout and the ratio of thermal conductivities of the composite system, the estimated values by simple equations are compared with the calculated ones by simulation, and the discussion is made on the validity of simple equations.
一般社団法人日本機械学会の論文
2009-11-06