438 MEMS用微小レジスト構造部材 : 基板間の接合強度に及ぼす膜厚の影響(T09-3 微小機械システムにおけるマイクロ・ナノ力学(3) マイクロ・ナノ実験力学,大会テーマセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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Bond strength between micro-sized photoresist specimens and Si substrate was evaluated to clarify the effects of film thickness, i. e. aspect ratio. Multiple micro-sized cylindrical specimens with a diameter of 125 μm were fabricated using an epoxy type photoresist, SU-8 on a silicon chip by photolithography. Bond strength tests were performed under bend load with SU-8 cylindrical specimens of various aspect ratios (0.6-0.9). The maximum bend moment increases with increasing aspect ratio. On the other hands, the maximum load is almost constant and independent with aspect ratio. These results indicate that the shear stress at failure is constant in this study. The results concluded that the delamination would occur by shear stress within the aspect ratio of 0.6-0.9.
2008-08-02