Effects of Specimen Dimensions on Adhesive Shear Strength between a Microsized SU-8 Column and a Silicon Substrate

概要

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The adhesive shear strength between a microsized SU-8 columnar specimen and a Si substrate has been evaluated, especially focusing on the effects of the bonded specimen dimensions using Weibull analysis. The adhesive shear strength complicatedly changed with changing dimensions of the SU-8 column. The m value for the adhesive shear strength is much smaller in SU-8 specimens with smaller columnar lengths, because the effective factor on the delamination, such as natural defects at the interface, should be widely scattered at the smaller columnar length. In contrast, the m value is much larger in the longest columns, which suggests that the dispersion of the natural defect should less affect the adhesive strength. This may be because that the longest SU-8 column should be softer than the others owing to the lower degree of cross-linking. All the results show that the adhesive shear stress is strongly affected by the bonded film thickness, because the effects of natural defects and/or mechanical properties of bonded SU-8 may change by the thickness.
2012-06-25