M2-1 MEMS用微小構造部材の接合強度評価(M2 材料評価)

概要

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Micro-electro mechanical system (MEMS) devices have many interfaces between micro-sized photoresist patterns or components and Si substrates. Therefore, evaluation of interfacial adhesive strength is extremely important to design reliable MEMS devices. For quantitative evaluation of adhesive strength of micro-sized components, multiple micro-sized cylindrical adhesive specimens on a silicon chip were used. In this study, measurement of adhesive strength between SU-8 cylindrical specimens and Si substrate was performed using a micro-mechanical testing machine developed by our group. SU-8 cylindrical specimens with a diameter of 125μm and a height of 50, 100 and 150μm were fabricated on Si substrates by photolithographic technique. The averages of shear strength were 26.8MPa (height: 50, 100μm) and 21.3MPa (height: 150μm). From the observation of fracture surfaces, most specimens showed brittle fracture near the interface between SU-8 and Si substrate. Some specimens were, however, fractured after propagation of a crack in the interior of SU-8 and showing slight ductile behavior.
一般社団法人日本機械学会の論文
2009-10-15