2724 ダイヤモンド単結晶半導体基板の紫外光照射研磨技術の研究(S33-3 材料の超精密加工とマイクロ/ナノ加工の動向(3),S33 材料の超精密加工とマイクロ/ナノ加工の動向)

概要

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This research was carried out in order to develop the ultra-precision polishing technology of the single crystal diamond substrate. This substrate is expected to apply to a substrate for the next-generation semiconductor element used under specific environment. In this polishing process, after the carbon atoms are excited up to band gap energy of diamond by the photon energy, and the carbon atom will be finally oxidized. The oxidized carbon layer could be removed as CO or CO_2 during this polishing. As a result of evaluation of diamond (100) and diamond (111) polished surface by WYKO (interferometer microscope) and photon microscope, the high polishing rate and the good surface roughness (Ra:0.3nm) were confirmed.
社団法人日本機械学会の論文
2006-09-15