弾性定盤を用いたガラス磁気ディスク基板のポリシング特性

概要

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Glass disk substrates of 2.5 inch diameter were polished using two types of epoxy resin plate, which were of intermediate hardness between that of the metal lapping plate and polisher. The polishing characteristics were measured for various experimental conditions, such as the grooving condition, polishing pressure, and loose and/or fixed abrasives. From the experimental results, polishing using a combination of epoxy resin plates and CeO_2 abrasives of average diameter 0.7 μm shows a higher removal rate (MRR > 1.0 μm/min) with good surface roughness (Ra < 1.0 nm), flatness (within 0.3 μm in a diameter), and edge accuracy around the substrate. The higher removal rate was achieved due to an increase in the real micro-contact area between the resin plate and substrate. This can be explained well by the comparatively large elastic deformation of the resin plates, which was simulated with the aid of finite element analysis.
社団法人精密工学会の論文
2003-10-05