Flare in Microlithographic Exposure Tools

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Flare in Microlithographic Exposure Tools
Plasma-Assisted Dry Etching of Ferroelectric Capacitor Modules and Application to a 32M Ferroelectric Random Access Memory Devices with Submicron Feature Sizes
Integration of Ferroelectric Random Access Memory Devices with Ir/IrO_2/Pb(Zr_xTi_)O^^_3/Ir Capacitors Formed by Metalorganic Chemical Vapor Deposition-Grown Pb(Zr_xTi_)O_3
Enhanced Retention Characteristics of Pb(Zr, Ti)O_3 Capacitors by Ozone Treatment : Electrical Properties of Condensed Matter
Cyclopropyl-containing Photoacid Generators for Chemically Amplified Resists
Most Efficient Alternative Manner of Patterning sub-80nm Contact Holes and Trenches with 193nm Lithography
Process Technology for Next Generation Photomask
High Performance Lithography with Advanced Modified Illumination (Special Issue on Quarter Micron Si Device and Process Technologies)
Effects of SF_6 Addition to O_2 Plasma on Polyimide Etching
Etching Characteristics of Fine Ta Patterns with Electron Cyclotron Resonance Chlorine Plasma
Characteristics of the Linewdth Variation due to Flare and Its Dependency on Optical Parameters
Spectral Properties of Nd^_-Doped RO・Na_2O・Al_2O_3・P_2O_5 (R=Mg, Ca, Ba) Glass System
Quantitative Evaluation of Grid Size Effect on Critical Dimension Uniformity Improvement
Hot-Spot Detection and Correction Using Full-Chip-Based Process Window Analysis
Quantitative Evaluation of Grid Size Effect on Critical Dimension Uniformity Improvement
Most Efficient Alternative Manner of Patterning sub-80 nm Contact Holes and Trenches with 193 nm Lithography

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