熱サイクルを受けるCSP実装体のたわみと応力の解析(J01-3 熱変形と衝撃,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

論文の詳細を見る
In the present paper, a deformation induced in a new bonding technology of Chip Size Package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after cooling from a bonding temperature are measured experimentally for various kinds of substrate and the thickness of an integrated circuit using a laser beam. In particular, a simple theory on the basis of a multilayered plate theory considering a viscoelastic property in the substrate and encapsulation are presented, arid the thermo-viscoelastic analysis for the deflection of CSP is performed. We could show that the simple formula for multilayered plates based on the thermo-viscoelastic theory can estimate fairly well the deflection of CSP in experiment.
社団法人日本機械学会の論文
2004-09-04