K-0318 三次元境界要素法によるSMTはんだ接合体平衡形状決定の基礎的研究(S02-3 境界要素法とその周辺技術(3))(S02 境界要素法とその周辺技術)

概要

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Recently, surface mount technology (SMT) in a microelectronic packaging is playing a leading role compared to the plated-through-hole technology. Many investigations on SMT have been conducted numerically and experimentally. Thermal stress analysis is needed for evaluating the reliability of solder joints. At that time, it is very important to know the domain shape for analysis, although it is usually difficult to measure in situ the profile of SMT solder joints mounted on the base plate. In the present paper, the three-dimensional shape of solder joints is determined numerically by employing a multi-zone BEM, where the surface tension of molten solder and gravity are considered. The joint profile varying from an initial profile to an equilibrium one is simulated using a finite difference scheme for time and the boundary element method for domain.
社団法人日本機械学会の論文
2001-08-22