Effect of N_2 Addition on Aluminum Alloy Etching by Electron Cyclotron Resonance Reactive Ion Etching and Magnetically Enhanced Reactive Ion Etching
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概要
- 論文の詳細を見る
Aluminum alloy etching is an important process in ultra-large-scale integration (ULSI) fabrication. We investigated the effect of N_2 addition to Cl_2+BCl_3 gas mixture on aluminum-copper alloy etching by electron cyclotron resonance reactive ion etching (ECR-RIE) and magnetically enhanced reactive ion etching (MERIE). In ECR-RIE, N_2 addition was effective in suppressing residues and post-etch corrosion of aluminum alloy interconnects; on the other hand, in MERIE, N_2 addition promoted the formation of residues and post-etch corrosion. This difference is probably caused by BCl^+_X in plasma, because it was found by mass spectral analysis that N_2 addition increased the amount of BCl^+_X in plasma of ECR-RIE, but it decreased that in plasma of MERIE.
- 社団法人応用物理学会の論文
- 1995-04-30
著者
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Fujiwara Nobuo
Ulsi Laboratory Mitsubishi Electric Corporation
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Yoneda Masahiro
Ulsi Laboratory Mitsubishi Electric Corporation
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Kusumi Yoshihiro
ULSI Laboratory, Mitsubishi Electric Corporation
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Matsumoto Junko
ULSI Laboratory, Mitsubishi Electric Corporation
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Kusumi Yoshihiro
Ulsi Laboratory Mitsubishi Electric Corporation
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Matsumoto Junko
Ulsi Laboratory Mitsubishi Electric Corporation
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Fujiwara Nobuo
ULSI Development Center, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664-8641, Japan
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- Effect of N_2 Addition on Aluminum Alloy Etching by Electron Cyclotron Resonance Reactive Ion Etching and Magnetically Enhanced Reactive Ion Etching
- Mechanism of Reactive Ion Etching Lag for Aluminum Alloy Etching
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- Effects of Charge Build-up of Underlying Layer by High Aspect Ratio Etching
- Effect of Electron Shading on Gate Oxide Degradation
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