Lateral Integration of Zn and Al Dots with Nanometer-Scale Precision by Near Field Optical Chemical Vapor Deposition Using a Sharpened Optical Fiber Probe(Special Issue on Near-Field Optics and Its Applications)

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概要

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• In-situ position-controlled lateral deposition of nanometer-size Zn and Al dots on a sapphire substrate was accomplished by dissociating diethylzinc and trimethylaluminum using an optical near field on a sharpened optical fiber probe tip. The minimum diameters of the Zn and Al dots deposited were 37 and 25 nm, respectively, comparable with the apex diameter of the fiber probe. By changing the reactant molecules during deposition, nanometric Zn and Al dots were successively deposited on the same sapphire substrate with high precision. The distance between these dots was as short as 100 nm.

• 社団法人電子情報通信学会の論文
• 2002-12-01

著者

• Ohtsu Motoichi

  Department Of Electrical Engineering And Information Systems The University Of Tokyo

• Lee Geun

  Japan Science And Technology Corporation

• YAMAMOTO Yoh

  Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology

• KOUROGI Motonobu

  Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology

• OHTSU Motoichi

  Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology

• KAWAZOE Tadashi

  Japan Science and Technology Corporation

• Yamamoto Yoshitsugu

  Optoelectronic And Microwave Devices Laboratory Mitsubishi Electric Corporation

• Ohtsu M

  Department Of Electrical Engineering And Information Systems School Of Engineering The University Of

• Ohtsu Motoichi

  Interdisciplinary Graduate School Of Science And Engineering Tokyo Institute Of Technology

• OHTSU Motoichi

  The University of Tokyo

• Kourogi M

  Interdisciplinary Graduate School Of Science And Engineering Tokyo Institute Of Technology:japan Sci

• Kourogi Motonobu

  Interdisciplinary Graduate School Of Science And Engineering Tokyo Institute Of Technology:optical C

• Ohtsu Motoichi

  Department of Electrical Engineering and Information Systems, The University of Tokyo

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