薄片状シリカEPDペレットによるシリコンウエハの研削特性(機械要素,潤滑,工作,生産管理など)

概要

論文の詳細を見る
Grinding performance of fine abrasive grinding wheel to silicon wafer were investigated. In this study, thin-plate silica powder, tens μm in length and 1 μm in width, were applied as a abrasive for grinding wheel. The grinding wheel were fabricated using a electrophoretic deposition phenomenon, it was called "EPD pellet", and thin-plate silica abrasives could be arranged in a one-way direction in the EPD pellet. Grinding efficiency of thin-plate silica EPD pellet was twice as high as a conventional EPD pellet which was consist of spherical silica abrasive. Warp of thin-wafer, 150 μm in thickness ground by diamond wheel, were decreased with the progress of EPD grinding. This result shows that a residual strain by a diamond wheel could be removed by EPD grinding.
一般社団法人日本機械学会の論文
2002-09-25