プラスチックパッケージにおける界面き裂のはく離限界

概要

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Delamination along an interface between lead metal and molding resin is one of the main causes of the failure of electronic packeges. Evaluation of mixed mode stress intensity factors (SIF_s) of a crack along the interface is useful for strength evaluation of electronic devices. Large residual stress is often induced along the interface because of the different coefficients of thermal expansion of metal and resin. We performed mixed mode delamination tests of joined end notched fiexure (ENF) specimens and measured residual stress along the interface. The mixed mode delamination criterion including the effect of residual stress was successfully described by the SIF_s for an interface crack. These SIF_s were calculated from the test results using the virtual crack extension method together with the finite element method which we developed for an interface crack under thermal stress. The effects of the mode mixity of the SIF_s and residual stress depend on the combination of materials, and these effects are sometimes very great.
一般社団法人日本機械学会の論文
2000-08-25