Three Dimensional Stress Mapping of Silicon Surrounded by Copper Filled through Silicon Vias Using Polychromator-Based Multi-Wavelength Micro Raman Spectroscopy
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概要
- 論文の詳細を見る
- 2010-08-25
著者
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Kumar Rakesh
Institute Of Microelectronics/a Star
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Kwong Dim
Institute Of Microelectronics/a Star
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Kang Kitaek
WaferMasters, Inc.
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Yoo Woo
WaferMasters, Inc.
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Yoo Woo
Wafer Masters Inc.
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Yoo Woo
Institute Of Microelectronics/a Star
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Kang Kitaek
Wafer Masters Inc.
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TRIGG Alastair
Institute of Microelectronics
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Trigg Alastair
Institute Of Microelectronics/a Star
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UEDA Takeshi
WaferMasters, Inc.
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ISHIGAKI Toshikazu
WaferMasters, Inc.
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Yu Li
Institute of Microelectronics/ASTAR, 11 Science Park Road, 117685, Singapore
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Cheng Cheng
Institute of Microelectronics/ASTAR, 11 Science Park Road, 117685, Singapore
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Ueda Takeshi
Wafermasters Inc.
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Ishigaki Toshikazu
Wafermasters Inc.
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Cheng Cheng
Institute Of Microelectronics/a Star
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Yu Li
Institute Of Biomedical Engineering Central South University
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Yu Li
Institute Of Microelectronics/a Star
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Kwong Dim
Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685
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- Three Dimensional Stress Mapping of Silicon Surrounded by Copper Filled through Silicon Vias Using Polychromator-Based Multi-Wavelength Micro Raman Spectroscopy
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